BASF Packaging Developer Optoelectronic Microsystems (m/f/d) in Ludwigshafen, Germany
Job Field : Research & Development
Location : Ludwigshafen,DEU
Company : trinamiX GmbH
Job ID : EN58263681ONLE17
trinamiX GmbH was established in 2015 with its headquarters in Ludwigshafen and is a wholly owned subsidiary of BASF SE. As a start-up, we are operationally independent and can, at the same time, rely on the competence and experience of the BASF Group. What drives us? Our technologies are designed to make it possible for humans and machines to capture and understand the world - for better decision-making and more security. That is our goal in the areas of 3D sensor technology, distance measurement and infrared sensor technology. We are not looking for successors or replacements for our team. We are looking for pioneers!
Learn more about trinamiX GmbH at trinamixsensing.com/about-trinamix/
Do you have questions about the application process or the position? Ms. Laura Deland (Talent Acquisition), E-Mail: Laura.Deland@basf.com
Cooperation with recruitment agencies is not accepted.
Please note that we do not return paper applications including folders. Please submit copies only and no original documents.
What you can expect
As a reinforcement of our Sensor Development Team, you will contribute to the establishment and development of our packaging activities.
You Identify new technologies and partners for optoelectronic packaging of infrared detectors and subsystems.
Furthermore, you initiate and manage projects with external and internal partners to transfer optoelectronic packaging ideas into new manufacturing processes.
You design, develop, and implement packages for detector systems with photonic, electronic, and thermal control functionalities.
What we expect
2+ years of work experience in optoelectronics, electronics, and/or MEMS packaging, preferably in the Infrared
PhD or equivalent work experience in physics, electrical engineering, mechanical engineering or similar
familiar with assembly processes such as dicing, die attach, flip-chip bond, wire-bond, encapsulation, underfill, molding, pick-and-place, singulation
experience in managing projects with international partners in the electronics packaging industry
creative solutions and out-of-the-box thinking for challenging and exciting problems in optoelectronics packaging
effective team player that excels in a fast-paced, highly dynamic, interdisciplinary and international environment
good written and oral communication skills in English
An attractive competitive salary that is based on the company's success and your individual performance.
Flexible work arrangements so that you can balance your working life and private life.